Product & Development Engineering (PDE) group is seeking strong individuals for Flip Chip Business
Development position; to promote our flip-chip portfolio to customers and market a wide portfolio of flip chip product and
differentiating technologies to secure new design wins.
The job requires extensive customer interaction and ‘push-marketing’ of flip chip package capabilities for a wide
range of end-applications. The individual also need to manage and oversee the translation of the design wins into qualified,
revenue-generating products, and need to co-work with Sales, R&D and factory engineering teams to accomplish the above.
Key Job Requisites:
¨ Familiarity with flip chip packaging e.g. in areas of:
o Flip chip package applications in Mobile, Automotive as well as high-end ASIC/GPU/CPU applications
o Wafer Bumping (plating, printing and others; eutectic, hi Pb, Pb-free)
o Assembly process technologies (chip attach, under fill, heat spreader etc.)
o Substrate technologies (build-up, PTFE, laminate, etc)
o Reliability, Metrology and F/A methodologies
o Package design & Simulation process and tools
¨ Direct experience or Basic understanding in below areas is a plus:
o Specific marketing or customer facing experience in the Semiconductor packaging Industry
o Familiarity with market analysis and cost modeling
o Familiarity with business development
o Substrate Design, Modeling and Simulation
¨ Working knowledge and familiarity of conventional packaging technologies (wire bond, molding, substrates etc)
¨ Results-oriented approach and resourcefulness to drive projects. New Business Opportunities to a successful endpoint.
¨ Good communication skills and ability to work with multiple organizations and groups within and outside the company
¨ Proficiency in using Microsoft Office tools (Power point, Excel, Project, Word etc.) is essential.
¨ Domestic and International Travel Required.
Education & Experience Requirements:
• Five (5) years minimum in semiconductor packaging or related field
• BS or Master Degree in Engineering. MBA preferred
• Strong written, verbal, organizational & interpersonal skills
• Motivated, self starter with demonstrated leadership skills and ability to manage multiple projects.
Role: Flip Chip Business Development Manager-Semiconductor Packaging
Location: San Diego,
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